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Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ
Max
Units
Off Characteristics
BV DSS
? BV DSS
? T J
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
V GS = 0 V, I D = –10 μ A
I D = –10 μ A,Referenced to 25 ° C
–60
–53
V
mV/ ° C
I DSS
Zero Gate Voltage Drain Current
V DS = –48 V,
V GS = 0 V
–1
μ A
V DS = –48 V,V GS = 0 V T J = 125 ° C
–200
μ A
I GSS
Gate–Body Leakage.
V GS = ± 20 V,
V DS = 0 V
± 10
nA
On Characteristics
(Note 2)
V GS(th)
Gate Threshold Voltage
V DS = V GS ,
I D = –1 mA
–1
–1.7
–3.5
V
? V GS(th)
? T J
Gate Threshold Voltage
Temperature Coefficient
I D = –1 mA,Referenced to 25 ° C
3
mV/ ° C
R DS(on)
I D(on)
Static Drain–Source
On–Resistance
On–State Drain Current
V GS = –10 V, I D = –0.5 A
V GS = –4.5 V, I D = –0.25 A
V GS = –10 V,I D = –0.5 A,T J =125 ° C
V GS = –10 V, V DS = – 10 V
–0.6
1.0
1.3
1.7
10
20
16
?
A
g FS
Forward Transconductance
V DS = –10V,
I D = – 0.1 A
70
430
mS
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –25 V,
f = 1.0 MHz
V GS = 0 V,
79
10
4
pF
pF
pF
R G
Gate Resistance
V GS = –15 mV, f = 1.0 MHz
10
?
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
V DD = –25 V,
V GS = –10 V,
V DS = –48 V,
V GS = –10 V
I D = – 0.12 A,
R GEN = 6 ?
I D = –0.5 A,
2.5
6.3
10
7.5
1.8
0.3
5
12.6
15
15
2.5
ns
ns
ns
ns
nC
nC
Q gd
Gate–Drain Charge
0.4
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Sourc e Diode Forward Current
–0.24
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = –0.24 A (Note 2)
–0.8
–1.5
V
Voltage
t rr
Diode Reverse Recovery Time
I F = –0.5A
17
nS
Q rr
Diode Reverse Recovery Charge
d iF /d t = 100 A/μs
(Note 2)
15
nC
Notes:
1.
R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 350°C/W when mounted on a
minimum pad..
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
NDS0610 Rev B(W)
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